DOD · Navy Pre-Release SBIR · Phase I
DON27BZ02-NV011

Low-cost Mid-wave Infrared Focal-Plane Array (FPA) Fabrication through Direct-bond Interconnection

Parent BAA: DoW SBIR 2027 BAA · Release 2
Opens
Dec 2, 2026
Closes
Jan 6, 2027
Deadline
—
Component
Navy
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Technical Point of Contact

Richard Espinola; Myron Pauli

During pre-release, until the topic opens on Dec 2, 2026, you may contact the topic author directly with technical questions. After that, questions go through the Topic Q&A on DSIP.

Projected CMMC Level Requirement

Level 2 (Self)

Technology Areas

  • None

Modernization Priorities

  • Integrated Sensing and Cyber
  • Microelectronics

Keywords

  • Focal plane array
  • FPA
  • direct-bond interconnection
  • DBI
  • 3D heterogeneous integration
  • 3D HI
  • infrared imaging
  • IR
  • semiconductor processing
  • read out integrated circuit
  • ROIC
  • sensor chip assembly
  • SCA
  • mid-wave infrared
  • MWIR
  • IR detector materials

Objective Summary

Develop a focal-plane array (FPA) fabrication process based on wafer-scale 3D-heterogeneous integration that enables a mid-wave infrared (MWIR) III-V detector epi-layer wafer to be directly bonded to a Silicon-based read-out integrated circuit (Si-ROIC) wafer, thereby eliminating the inefficient die-level Indium (In) bump-bonding process currently required to assemble Mid-wave Infrared (MWIR) FPA sensor chips.

The full objective, description, Phase I, II and III requirements and evaluation criteria are in the official topic on DSIP.

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Topic details summarized from the official DoW SBIR/STTR solicitation. The full solicitation text, phase descriptions, evaluation criteria and submission requirements are published by the Department of War at dodsbirsttr.mil. Defense Grant Writers does not host or reproduce solicitation content.