DOD · Navy Pre-Release SBIR · Phase I
DON27BZ02-NV018

Rapid Thermoplastic Patching Capability for Legacy Thermoset Airframe Sustainment

Parent BAA: DoW SBIR 2027 BAA · Release 2
Opens
Dec 2, 2026
Closes
Jan 6, 2027
Deadline
—
Component
Navy
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Technical Point of Contact

Anisur Rahman; Neil Graf

During pre-release, until the topic opens on Dec 2, 2026, you may contact the topic author directly with technical questions. After that, questions go through the Topic Q&A on DSIP.

Projected CMMC Level Requirement

Level 2 (Self)

Technology Areas

  • None

Modernization Priorities

  • Advanced Materials
  • Sustainment & Logistics

Keywords

  • Thermoplastic Patching
  • Thermoset Airframe Repair
  • Fusion Welding
  • Interfacial Bonding
  • Rapid Sustainment
  • Out of Autoclave

Objective Summary

Deliver a rapid, high-strength thermoplastic patching capability for legacy thermoset composite airframes by developing the necessary interfacial enabling technologies to fuse the incompatible polymer systems.

The full objective, description, Phase I, II and III requirements and evaluation criteria are in the official topic on DSIP.

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Topic details summarized from the official DoW SBIR/STTR solicitation. The full solicitation text, phase descriptions, evaluation criteria and submission requirements are published by the Department of War at dodsbirsttr.mil. Defense Grant Writers does not host or reproduce solicitation content.