DOD · Navy Pre-Release STTR · Phase I
DON27TZ02-NV001

Co-Packaged Optics (CPO) for Advanced Cryocooled Electro-Optical/Infrared (EO/IR) Sensors

Parent BAA: DoW STTR 2027 BAA · Release 2
Opens
Dec 2, 2026
Closes
Jan 6, 2027
Deadline
—
Component
Navy
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Technical Point of Contact

Richard Espinola; Deborah VanVechten

During pre-release, until the topic opens on Dec 2, 2026, you may contact the topic author directly with technical questions. After that, questions go through the Topic Q&A on DSIP.

Projected CMMC Level Requirement

Level 2 (Self)

Technology Areas

  • None

Modernization Priorities

  • Integrated Sensing and Cyber
  • Microelectronics

Keywords

  • Co-packaged optics
  • CPO
  • silicon photonics
  • interconnects
  • read out integrated circuit
  • ROIC
  • sensors
  • Electro-Optical/Infrared
  • EO/IR

Objective Summary

Develop and demonstrate innovative Co-Packaged Optics (CPO) architectures and integration techniques for advanced cryocooled Electro-Optical/Infrared (EO/IR) sensor systems that significantly reduce the number of electrical wirebonds, increase bandwidth density, and withstand rugged maritime environments for deployment in advanced sensing and tactical edge computing platforms.

The full objective, description, Phase I, II and III requirements and evaluation criteria are in the official topic on DSIP.

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Topic details summarized from the official DoW SBIR/STTR solicitation. The full solicitation text, phase descriptions, evaluation criteria and submission requirements are published by the Department of War at dodsbirsttr.mil. Defense Grant Writers does not host or reproduce solicitation content.