DOD · OSD Open SBIR · Phase I
OSW26BZ06-NV026

Defect Metrology and Charge Trapping Dynamics in Transfer-Doped Diamond Transistors

Parent BAA: DoW SBIR 2026 BAA · Release 6
Opens
Sep 23, 2026
Closes
Oct 21, 2026
Deadline
—
Component
OSD

Projected CMMC Level Requirement

Level 2 (Self)

Technology Areas

  • None

Modernization Priorities

  • Microelectronics
  • Quantum Science

Keywords

  • Diamond Transistors
  • Charge Trapping
  • Current Collapse
  • Semiconductor Metrology
  • Ultra-Wide Bandgap (UWBG)
  • RF Power Electronics
  • Defect Dynamics
  • Surface-Channel Devices
  • Hydrogen-terminated Diamond.

Objective Summary

Develop an innovative, non-destructive diamond semiconductor defect metrology technique and laboratory-scale apparatus to identify, quantify, determine location in the device, and energetically characterize charge traps that cause current collapse in surface-channel diamond transistors.

The full objective, description, Phase I, II and III requirements and evaluation criteria are in the official topic on DSIP.

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Topic details summarized from the official DoW SBIR/STTR solicitation. The full solicitation text, phase descriptions, evaluation criteria and submission requirements are published by the Department of War at dodsbirsttr.mil. Defense Grant Writers does not host or reproduce solicitation content.