Wafer-scale low-loss hyperbolic optical material
Technical Point of Contact
During pre-release, until the topic opens on Dec 2, 2026, you may contact the topic author directly with technical questions. After that, questions go through the Topic Q&A on DSIP.
Direct contact with the topic author ended when this topic opened on Dec 2, 2026. Post technical questions in the Topic Q&A on DSIP while it is open.
Projected CMMC Level Requirement
Technology Areas
Modernization Priorities
Keywords
Objective Summary
The overall goal of the R&D effort is to develop wafer-scale, fabrication-ready thin films of a low-loss naturally hyperbolic optical material that operates across the visible to telecommunication wavelength range. Films should be of high optical and crystalline quality, with controlled thickness and orientation, on substrates at least one inch in cross-sectional diameter.
The full objective, description, Phase I, II and III requirements and evaluation criteria are in the official topic on DSIP.
Ready to respond to OSW27TZ02-NV001?
Our defense clients have secured $169M+ in government contracts. Fixed pricing from $1,995 for white papers and concept papers, $9,995 for full BAA technical volumes.
Book Free 30-Min ConsultationTopic details summarized from the official DoW SBIR/STTR solicitation. The full solicitation text, phase descriptions, evaluation criteria and submission requirements are published by the Department of War at dodsbirsttr.mil. Defense Grant Writers does not host or reproduce solicitation content.